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Dual, 4A/2A, 4MHz, Step-Down DC-DC
Regulator with Dual LDO Controllers
ABSOLUTE MAXIMUM RATINGS
AVIN, PVIN_, B_, DVDD_, EN_, FB_, RT,
SEL to SGND .........................................................-0.3V to +6V
COMP_ to SGND .....................................-0.3V to (V AVIN + 0.3V)
PGND_ to SGND ...................................................-0.3V to +0.3V
LX Current (Note 1)
Regulator 1...............................................................................6A
Regulator 2...............................................................................3A
Continuous Power Dissipation (T A = +70°C)
TQFN (derate 34.5mW/°C above +70°C) ................2758.6mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Current into Any Pin Other than PVIN_,
LX_ and PGND_.............................................................±50mA
Note 1: LX has internal diodes to PGND_ and PVIN_. Applications that forward bias these diodes should take care not to exceed
the IC’s package power dissipation limits.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance ( θ JA )...............29°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................2°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V AVIN = V PVIN_ = V DVDD_ = 3.3V, V PGND_ = V SGND = 0V, R T = 25k ? , and T A = T J = -40°C to +125°C, unless otherwise noted.
Typical values are at T A = +25°C.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SYSTEM SPECIFICATIONS
Input-Voltage Range
V AVIN = V PVIN1 = V PVIN2 = V DVDD1 =
V DVDD2
2.5
5.5
V
Undervoltage Lockout Threshold
AVIN rising
2.1
2.2
2.3
V
Undervoltage Lockout Hysteresis
0.12
V
Operating Supply Current
Shutdown Supply Current
V EN_ = 1.3V, V FB_ = 0.8V
V EN_ = 0V
3.5
30
6
65
mA
μA
PWM DIGITAL SOFT-START/SOFT-STOP
Soft-Start/Soft-Stop Duration
Reference Voltage Steps
PWM ERROR AMPLIFIERS
4096
64
Clock
Cycles
Steps
FB1, FB2 Input Bias Current
-1
+1
μA
FB1, FB2 Voltage Set-Point
0.593
0.599
0.605
V
COMP1, COMP2 Voltage Range
Error-Amplifier Open-Loop Gain
Error-Amplifier Unity-Gain
Bandwidth
I COMP _ = -250μA to +250μA
0.3
80
12
V AVIN - 0.5
V
dB
MHz
2
_______________________________________________________________________________________
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